JPH0220861Y2 - - Google Patents

Info

Publication number
JPH0220861Y2
JPH0220861Y2 JP17250183U JP17250183U JPH0220861Y2 JP H0220861 Y2 JPH0220861 Y2 JP H0220861Y2 JP 17250183 U JP17250183 U JP 17250183U JP 17250183 U JP17250183 U JP 17250183U JP H0220861 Y2 JPH0220861 Y2 JP H0220861Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
chip
hole
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17250183U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6079770U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17250183U priority Critical patent/JPS6079770U/ja
Publication of JPS6079770U publication Critical patent/JPS6079770U/ja
Application granted granted Critical
Publication of JPH0220861Y2 publication Critical patent/JPH0220861Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP17250183U 1983-11-07 1983-11-07 積層型ハイブリツドｉｃ Granted JPS6079770U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17250183U JPS6079770U (ja) 1983-11-07 1983-11-07 積層型ハイブリツドｉｃ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17250183U JPS6079770U (ja) 1983-11-07 1983-11-07 積層型ハイブリツドｉｃ

Publications (2)

Publication Number Publication Date
JPS6079770U JPS6079770U (ja) 1985-06-03
JPH0220861Y2 true JPH0220861Y2 (en]) 1990-06-06

Family

ID=30376007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17250183U Granted JPS6079770U (ja) 1983-11-07 1983-11-07 積層型ハイブリツドｉｃ

Country Status (1)

Country Link
JP (1) JPS6079770U (en])

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4562881B2 (ja) * 2000-08-18 2010-10-13 イビデン株式会社 半導体モジュールの製造方法
JP4562153B2 (ja) * 2000-08-10 2010-10-13 イビデン株式会社 半導体モジュールの製造方法
JP4550239B2 (ja) * 2000-08-10 2010-09-22 イビデン株式会社 半導体モジュールの製造方法
JP4562154B2 (ja) * 2000-08-10 2010-10-13 イビデン株式会社 半導体モジュールの製造方法
US8704359B2 (en) 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
FI115601B (fi) 2003-04-01 2005-05-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
JP6314297B1 (ja) * 2017-04-15 2018-04-25 株式会社サムス 電子部品モジュール装置及びその製造方法

Also Published As

Publication number Publication date
JPS6079770U (ja) 1985-06-03

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